STM32F102X8 datasheet(30/80 Pages) STMICROELECTRONICS

30 / 80 page

Electrical characteristics

STM32F102x8, STM32F102xB

30/80

DocID15056 Rev 5

5.3

Operating conditions

5.3.1

General operating conditions

Table 8. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK1

Internal APB1 clock frequency

fPCLK2

Internal APB2 clock frequency

VDD

Standard operating voltage

3.6

VDDA(1)

1. When the ADC is used, refer to Table 47: ADC characteristics.

Analog operating voltage

(ADC not used)

Must be the same potential

as VDD(2)

2. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV

between VDD and VDDA can be tolerated during power-up and operation.

23.6

Analog operating voltage

(ADC used)

2.4

3.6

VIN

I/O input voltage

Standard IO

–0.3

VDD+

0.3

FTIO(3)

3. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.

2 V < VDD ≤ 3.6 V

–0.3

5.5

VDD = 2 V

–0.3

5.2

BOOT0

5.5

Power dissipation at TA =

85 °C(4)

4. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal

characteristics on page 73).

LQFP48

363

LQFP64

444

Ambient temperature

Maximu

m power

dissipati

–40

°C

Low

power

dissipati

on(5)

5. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax

(see Table 6.2: Thermal characteristics on page 73).

–40

105

°C

Junction temperature range

–40

105

°C

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