MP2565DN datasheet(2/20 Pages) MPS

2 / 20 page

MP2565 – 2.5A, 4MHz, 50V STEP-DOWN CONVERTER

MP2565 Rev. 0.91

www.MonolithicPower.com

4/19/2011

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

For Tape & Reel, add suffix –Z (eg. MP2565DQ–Z); For RoHS Compliant Packaging, add suffix –LF ;

(eg. MP2565DQ–LF–Z)

For Tape & Reel, add suffix –Z (eg. MP2565DN–Z); For RoHS Compliant Packaging, add suffix –LF ;

(eg. MP2565DN–LF–Z)

PACKAGE REFERENCE

TOP VIEW

COMP

BST

VIN

FREQ

GND

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

COMP

BST

VIN

FREQ

GND

TOP VIEW

EXPOSED PAD

CONNECT TO GND

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage (VIN).....................–0.3V to +55V

Switch Voltage (VSW)...........................................

……………..–0.3V (-9V for <10ns) to VIN + 0.3V

BST to SW .....................................–0.3V to +6V

All Other Pins.................................–0.3V to +6V

Continuous Power Dissipation

(TA = +25°C)

(2)

3x3QFN10……………………………………2.5W

SOIC8………………………………………...2.5W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65°C to +150

°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.5V to 50V

Output Voltage VOUT.........................0.8V to 47V

Operating Temperature............. –40

°C to +85°C

Thermal Resistance

(4)

θJA

θJC

3x3 QFN10..............................50 ...... 12 ...

°C/W

SOIC8 (Exposed Pad) ............50 ...... 10 ...

°C/W

Notes:

1) Exceeding these ratings may damage the device

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any

ambient

temperature

calculated

PD(MAX)=(TJ(MAX)-TA)/

θJA. Exceeding the maximum

allowable power dissipation will cause excessive die

temperature, and the regulator will go into thermal shutdown.

Internal thermal shutdown circuitry protects the device from

permanent damage..

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.

Part Number*

Package

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Temperature

MP2565DQ

3x3 QFN10

–40

°C to +85°C

MP2565DN

SOIC8E

MP2565DN

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