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L16B06G-R24-R Datasheet(PDF) 12 Page - Unisonic Technologies |
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L16B06G-R24-R Datasheet(HTML) 12 Page - Unisonic Technologies |
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12 / 13 page ![]() L16B06 CMOS IC UNISONICTECHNOLOGIESCO.,LTD 12 of 13 www.unisonic.com.tw QW-R502-A45.a POWER DISSIPATION The power dissipation of a semiconductor chip is limited to its package and ambient temperature, in which the device requires the maximum output current calculated for given operating conditions. The maximum allowable power consumption can be calculated by the following equation: TJ (Junction temperature)(max)(°C) – TA(Ambient Temperature) PD(max)(watt)= RTH (Junction - to – air thermal resistance)(°C/watt) The power consumption of IC can be determined by the following equation an should be less than the maximum allowable power dissipation: PD(W) = VCC(V) × IDD(A) + VOUT 0 × IOUT 0 × DUTY 0 + ….. + VOUT 15 × IOUT 15 × DUTY 15 ≤ PD (max)(W) TYPICAL APPLICATION |
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