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BAS40 Datasheet(PDF) 14 Page - NXP Semiconductors |
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BAS40 Datasheet(HTML) 14 Page - NXP Semiconductors |
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14 / 22 page  BAS40_1PSXXSB4X_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 9 — 18 March 2015 14 of 22 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 21. Reflow soldering footprint SOD882 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ×) solder lands solder resist occupied area solder paste mbl872 1.30 0.30 R = 0.05 (8 ×) R = 0.05 (8 ×) 0.60 (2 ×) 0.70 (2 ×) 0.80 (2 ×) 0.90 0.30 (2 ×) 0.40 (2 ×) 0.50 (2 ×) solder lands solder resist occupied area solder paste |
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