SAW FILTER

HDF414.5AT

SMD-3

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Page 5 of 8

Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for

10±1 sec. Then release the device into the room conditions for 4 hours. The device shall

meet the specifications in table 1.

5-5 Solderability

Subject the device terminals into the solder bath at 245℃±5℃ for 5s, More than 95%

area of the terminals must be covered with new solder. It shall meet the specifications in

table 1.

5-6 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device

shall fulfill the specifications in table 1.

5-7 Vibration

Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of

1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1.

5-8 Lead fatigue

5-8-1

Pulling test

Weight along with the direction of lead without an shock 1kg. The device shall satisfy all the

initial Characteristics.

5-8-2

Bending test

Lead shall be subject to withstand against 90℃ bending with 450g weight in the direction

of thickness. This operation shall be done toward both direction. The device shall show no

evidence of damage and shall satisfy all the initial electrical characteristics.

6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction of

the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterioration & destruction of the component. Please

avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be soldered. Please avoid soldering another part of

component.

7. Packing

7.1 Dimensions

(1) Carrier Tape: Figure 1

(2) Reel: Figure 2

(3) The product shall be packed properly not to be damaged during transportation and storage.

7.2 Reeling Quantity

1000 pcs/reel

7’’

3000 pcs/reel

13’’