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MBR20100CT-T Datasheet(PDF) 1 Page - Chip Integration Technology Corporation |
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MBR20100CT-T Datasheet(HTML) 1 Page - Chip Integration Technology Corporation |
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1 / 3 page ![]() 1 Document ID : DS-11KH7 Revised Date : 2016/08/15 Revision : C2 ■ Maximum ratings and electrical characteristics O Rating at 25 C ambient temperature unless otherwise specified. 20A Trench Schottky Rectifier I O I F S M I R R M T J Forward rectified current (total device) Forward surge current (per diode) Typical Thermal resistance (per leg) Operating Junction temperature Parameter 8.3ms single half sine-wave superimposed on rate load (JEDEC method) Conditions Symbol MBR20100CT-T UNIT -55 ~ +150 20 150 A A O C/W O C 50 R θ J A Junction to ambient Peak repetitive reverse surge current A 2us - 1kHz 2 Working peak reverse voltage V RW M 100 V (per leg) MBR20100CT-T Chip Integration Technology Corporation Main Product Characteristics I F ( AV ) 2X10A V R R M T J V ( Ty p ) 100V O 150 C 0.66V Junction to case R θ J C 2 Storage temperature T S T G -55 ~ +150 ■ Outline TO-220AB symbol Dimensions in inches(millimeters) A B C D E F G H I J K L M N ØP Min Max 0.398(10.1) 0.406(10.3) 0.236(6.0) 0.252(6.4) 0.579(14.7) 0.594(15.1) 0.543(13.8) 0.551(14.0) 0.143(3.63) 0.159(4.03) 0.104(2.64) 0.112(2.84) 0.335(8.5) 0.350(8.9) 0.046(1.17) 0.054(1.37) 0.028(0.71) 0.036(0.91) 0.098(2.49) 0.102(2.59) 0.176(4.47) 0.184(4.67) 0.046(1.17) 0.054(1.37) 0.102(2.6) 0.110(2.8) 0.019(0.28) 0.021(0.48) 0.147(3.74) 0.155(3.94) symbol Dimensions in inches(millimeters) A B C D E F G H I J K L M N ØP Min Max 0.394(10.0) 0.413(10.5) 0.228(5.8) 0.268(6.8) 0.570(14.48) 0.625(15.87) 0.519(13.18) 0.558(14.18) 0.089(3.5) 0.099(3.9) 0.100(2.54) 0.120(3.04) 0.330(8.38) 0.350(8.9) 0.045(1.15) 0.060(1.52) 0.029(0.75) 0.037(0.95) 0.095(2.42) 0.105(2.66) 0.160(4.07) 0.190(4.82) 0.045(1.15) 0.055(1.39) 0.080(2.04) 0.110(2.8) 0.013(0.33) 0.019(0.52) 0.148(3.75) 0.156(3.95) Alternate Marking code A ØP B J L C D E F G H I K M N Marking code A ØP B J L C D E F G H I K M N C Dimensions in inches and (millimeters) ■ Circuit Diagram ■ Mechanical data • Epoxy : UL94-V0 rated flame retardant. . • Case : JEDEC TO-220AB molded plastic body • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026. ed. • Polarity: As mark . • Mounting Position : Any . • Weight : Approximated 2.25 gram ■ Features Low forward voltage drop. • Excellent high temperature stability. • Fast switching capability. • Lead-free parts meet environmental standards of • MIL-STD-19500 /228 Forward voltage drop (per diode) Reverse current (per diode) Parameter V F I R O V = V T = 25 C R R R M J O V = V T = 125 C R R R M J Conditions Symbol TYP. UNIT 10 0.1 mV mA MIN. MAX. O I = 10A, T = 25 C F J O I = 10A, T = 125 C F J 850 660 0.003 800 3 V B R Reverse Breakdown Voltage (per diode) 100 O I = 0.1mA, T = 25 C R J V 550 O I = 3A, T = 25 C F J |
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