| Manufacturer | Part # | Datasheet | Description |
 Maxim Integrated Produc... |
21-0144B
|
135Kb / 2P |
PACKAGE OUTLINE
Rev B |
 STATS ChipPAC, Ltd. |
QFP-EP
|
117Kb / 2P |
Exposed Pad Quad Flat Pack
|
 Protek Devices |
DFN-2-0402
|
280Kb / 5P |
package outline & pad layout
|
 Maxim Integrated Produc... |
21-0036
|
42Kb / 1P |
PACKAGE OUTLINE, 8L UMAX/USOP
Rev L |
|
21-0061
|
44Kb / 1P |
PACKAGE OUTLINE, 10L UMAX/USOP
Rev L |
|
21-0108
|
71Kb / 2P |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
Rev K |
|
21-0111
|
31Kb / 1P |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD
Rev E |
|
21-0137
|
48Kb / 2P |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
Rev J |
|
21-0429
|
71Kb / 2P |
PACKAGE OUTLINE, 10L TDFN, 3*2*0.75MM
REV .C |
|
90-0092
|
23Kb / 1P |
PACKAGE LAND PATTERN, (U8) UMAX 8 LEAD
Rev B |