| Manufacturer | Part # | Datasheet | Description |
 Integrated Circuit Solu... |
ICS280
|
160Kb / 8P |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body)
|
 Maxim Integrated Produc... |
21-0109B
|
35Kb / 1P |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
Rev B |
 Elantec Semiconductor |
MDP0040
|
149Kb / 1P |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
 STATS ChipPAC, Ltd. |
QFP-EP
|
117Kb / 2P |
Exposed Pad Quad Flat Pack
|
 Protek Devices |
DFN-2-0402
|
280Kb / 5P |
package outline & pad layout
|
 Maxim Integrated Produc... |
21-0066
|
42Kb / 1P |
PACKAGE OUTLINE, TSSOP 4.40MM BODY
Rev L |
|
21-0111
|
31Kb / 1P |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD
Rev E |
|
21-0137
|
48Kb / 2P |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
Rev J |
|
90-0117
|
29Kb / 1P |
PACKAGE LAND PATTERN, (U16) 4.4MM TSSOP, 16 LEADS
Rev C |
|
90-0171
|
28Kb / 1P |
PACKAGE LAND PATTERN, (U28) 4.4MM TSSOP
Rev B |