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FCIP Datasheet (PDF) - Amkor Technology
FCIP Datasheet PDF - Amkor Technology
Part # FCIP
Download  FCIP Download
File Size   1242.94 Kbytes
Page   4 Pages
Manufacturer  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry.

FCIP Datasheet (PDF)

Go To PDF Page Download Datasheet
FCIP Datasheet PDF - Amkor Technology

Part # FCIP
Download  FCIP Click to download

File Size   1242.94 Kbytes
Page   4 Pages
Manufacturer  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology
Description Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry.

FCIP Datasheet (HTML) - Amkor Technology


FCIP Product details

Features
Incorporates standard JEDEC pitches and CSP solder ball diameters
Compatible with standard SMT assembly and test techniques
Utilizes cost-effective thin film redistribution technologies
Backside laser mark compatible
No need for underfill in most applications
Full turnkey CSPnl processing including test and tape & reel support
Eutectic lead-free solder balls
Available with polyimide repassivation
Qualified and in volume production
Proven reliability; exceeds all current handset mechanical reliability tests including drop, bend and key punch




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About Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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