| Manufacturer | Part # | Datasheet | Description |
 STATS ChipPAC, Ltd. |
QFP-EP
|
117Kb / 2P |
Exposed Pad Quad Flat Pack
|
 EUROQUARTZ limited |
G576
|
226Kb / 1P |
7 x 5 x 1.8mm 6 pad SMD
|
|
GV576
|
226Kb / 1P |
7 x 5 x 1.8mm 6 pad SMD
|
 NXP Semiconductors |
SOT486-1
|
242Kb / 1P |
plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
2008 |
 Maxim Integrated Produc... |
21-0108
|
71Kb / 2P |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
Rev K |
 ILSI America LLC |
IL3R
|
46Kb / 2P |
4 Pad Plastic Package, 1.4 mm x 7 mm
|
|
ILCX04
|
46Kb / 2P |
4 Pad Ceramic Package, 5 mm x 7 mm
|
|
ILCX10
|
53Kb / 2P |
2 Pad Ceramic Package Quartz Crystal, 5 mm x 7 mm
|
 EUROQUARTZ limited |
HDW576
|
138Kb / 1P |
7 x 5 x 1.8mm 6 pad SMD
|
 NXP Semiconductors |
NAFE11388
|
226Kb / 7P |
thermal enhanced very thin quad flat package, no leads, dimple wettable flank; 64 terminals, 0.5 mm pitch, 9 mm x 9 mm x 0.85 mm body
Rev. 1-29 December 2021 |