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AM6548BACDXEAF Datasheet(PDF) 253 Page - Texas Instruments |
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AM6548BACDXEAF Datasheet(HTML) 253 Page - Texas Instruments |
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253 / 282 page ![]() 8.4.5 Peripherals 8.4.5.1 ADC The Analog-to-Digital Converter (ADC) module contains a single 12-bit ADC which can be multiplexed to any 1 of 8 analog inputs (channels). For more information, see Analog-to-Digital Converter (ADC) section in the device TRM. 8.4.5.2 CAL The Camera Adapter Layer Subsystem (CALSS) is based on a Camera Adaptation Layer (CAL) module, which enables connection to multiple camera sensors through shared MIPI D-PHY module and LVDS receiver. CAL Module (CALSS0) is a very flexible subsystem that enables connection to multiple cameras supporting MIPI CSI-2 over D-PHY serial interface, a LVDS serial interface, and a traditional parallel interface. It also includes an internal write DMA engine connected to VBUSM interface. For more information, see Camera Adapter Layer (CAL) Subsystem section in the device TRM. 8.4.5.3 CPSW2G The two-port Gigabit Ethernet MAC (MCU_CPSW0) subsystem provides Ethernet packet communication for the device and is configured in a similar manner as a two-port Ethernet switch. MCU_CPSW0 features the Reduced Gigabit Media Independent Interface (RGMII), Reduced Media Independent Interface (RMII), and the Management Data Input/Output (MDIO) interface for physical layer device (PHY) management. For more information, see Gigabit Ethernet MAC (MCU_CPSW0) section in the device TRM. 8.4.5.4 DCC The Dual Clock Comparator (DCC) is used to determine the accuracy of a clock signal during the time execution of an application. Specifically, the DCC is designed to detect drifts from the expected clock frequency. The desired accuracy can be programed based on calculation for each application. The DCC measures the frequency of a selectable clock source using another input clock as a reference. For more information, see Dual Clock Comparator (DCC) section in the device TRM. 8.4.5.5 DDRSS The DDR subsystem in this device comprises DDR controller, DDR PHY and wrapper logic to integrate these blocks in the device. The DDR subsystem is referred to as DDRSS0 and is used to provide an interface to external SDRAM devices which can be utilized for storing program or data. DDRSS0 is accessed via MSMC, and not directly through the system interconnect. For more information, see DDR Subsystem (DDRSS) section in the device TRM. 8.4.5.6 DSS The Display Subsystem (DSS) is a flexible, multi-pipeline subsystem that supports high-resolution display outputs. DSS includes input pipelines providing multi-layer blending with transparency to enable on-the-fly composition. Various pixel processing capabilities are supported, such as color space conversion and scaling, among others. DSS includes a DMA engine, which allows direct access to the frame buffer (device system memory). Display outputs can connect seamlessly to an Open LVDS Display Interface transmitter (OLDITX), or can directly drive device pads as a parallel video output interface. For more information, see Display Subsystem (DSS) section in the device TRM. 8.4.5.7 ЕCAP Integrated in the MAIN domain one Enhanced Capture (ECAP) module provides accurate timing of events. When not being used for event capture, its resources can be used to generate a single channel of asymmetrical PWM waveforms (configurable as either one capture input, or as one auxiliary PWM output). ECAP module can be used for: • Sample rate measurements of audio inputs www.ti.com AM6548, AM6528, AM6526 SPRSP52B – DECEMBER 2019 – REVISED JUNE 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 253 Product Folder Links: AM6548 AM6528 AM6526 |
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