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AM6548BACDXEAF Datasheet(PDF) 253 Page - Texas Instruments

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Part # AM6548BACDXEAF
Description  AM654x, AM652x Sitara??Processors Silicon Revision 2.1
PDF  282 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AM6548BACDXEAF Datasheet(HTML) 253 Page - Texas Instruments

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8.4.5 Peripherals
8.4.5.1 ADC
The Analog-to-Digital Converter (ADC) module contains a single 12-bit ADC which can be multiplexed to any 1
of 8 analog inputs (channels).
For more information, see Analog-to-Digital Converter (ADC) section in the device TRM.
8.4.5.2 CAL
The Camera Adapter Layer Subsystem (CALSS) is based on a Camera Adaptation Layer (CAL) module, which
enables connection to multiple camera sensors through shared MIPI D-PHY module and LVDS receiver.
CAL Module (CALSS0) is a very flexible subsystem that enables connection to multiple cameras supporting MIPI
CSI-2 over D-PHY serial interface, a LVDS serial interface, and a traditional parallel interface. It also includes an
internal write DMA engine connected to VBUSM interface.
For more information, see Camera Adapter Layer (CAL) Subsystem section in the device TRM.
8.4.5.3 CPSW2G
The two-port Gigabit Ethernet MAC (MCU_CPSW0) subsystem provides Ethernet packet communication for
the device and is configured in a similar manner as a two-port Ethernet switch. MCU_CPSW0 features the
Reduced Gigabit Media Independent Interface (RGMII), Reduced Media Independent Interface (RMII), and the
Management Data Input/Output (MDIO) interface for physical layer device (PHY) management.
For more information, see Gigabit Ethernet MAC (MCU_CPSW0) section in the device TRM.
8.4.5.4 DCC
The Dual Clock Comparator (DCC) is used to determine the accuracy of a clock signal during the time
execution of an application. Specifically, the DCC is designed to detect drifts from the expected clock frequency.
The desired accuracy can be programed based on calculation for each application. The DCC measures the
frequency of a selectable clock source using another input clock as a reference.
For more information, see Dual Clock Comparator (DCC) section in the device TRM.
8.4.5.5 DDRSS
The DDR subsystem in this device comprises DDR controller, DDR PHY and wrapper logic to integrate these
blocks in the device. The DDR subsystem is referred to as DDRSS0 and is used to provide an interface to
external SDRAM devices which can be utilized for storing program or data. DDRSS0 is accessed via MSMC,
and not directly through the system interconnect.
For more information, see DDR Subsystem (DDRSS) section in the device TRM.
8.4.5.6 DSS
The Display Subsystem (DSS) is a flexible, multi-pipeline subsystem that supports high-resolution display
outputs. DSS includes input pipelines providing multi-layer blending with transparency to enable on-the-fly
composition. Various pixel processing capabilities are supported, such as color space conversion and scaling,
among others. DSS includes a DMA engine, which allows direct access to the frame buffer (device system
memory). Display outputs can connect seamlessly to an Open LVDS Display Interface transmitter (OLDITX), or
can directly drive device pads as a parallel video output interface.
For more information, see Display Subsystem (DSS) section in the device TRM.
8.4.5.7 ЕCAP
Integrated in the MAIN domain one Enhanced Capture (ECAP) module provides accurate timing of events.
When not being used for event capture, its resources can be used to generate a single channel of asymmetrical
PWM waveforms (configurable as either one capture input, or as one auxiliary PWM output).
ECAP module can be used for:
• Sample rate measurements of audio inputs
www.ti.com
AM6548, AM6528, AM6526
SPRSP52B – DECEMBER 2019 – REVISED JUNE 2021
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: AM6548 AM6528 AM6526



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