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Contact Plating

30 = 30u" Gold

USB3070

30

Specifications

Material

Plastic Housing: LCP, UL94V-0, Black

Contact Terminal: Copper Alloy

Metallic Shell: Stainless Steel SUS 304 T = 0.25mm

Plating

Underplating: 50µ" Nickel

Contact Area: 30µ" Gold plating

Solder Tails: Gold Flash

Metallic Shell: Matte Tin

Electrical

Voltage Rating: 30 V AC

Current Rating: Signal (Pins 2,3,4): 1.0 A.

Power (Pins1,5): 1.8A.

Operating Temperature: -30°C to +85°C

Contact Resistance: 30 mΩ max.

Insulating Resistance: 1000 MΩ min.

Dielectric Withstand Voltage: 500V AC/minute

Mechanical & Environmental

Mating Force: 35N max.

Unmating Force: Initial 10N min.

Final 8N min after durability test

Durability: 10,000 Cycles

A

Packing Options

A = Tape & Reel

(1.5K per Reel)

4.75±0.20

0.40

2.60

1.30

3.20

7.60

10.80

PCB Edge

Designed to comply with physical, electrical and environmental

requirements of Micro USB Standard (USB2.0).

Recommended PCB Layout

as viewed from component side General Tolerance: ±0.05

Solder Area

Component Outline

0.65±0.08

9.50±0.30

7.9±0.20

0.38

7.40±0.20

0.65

6.90+0.04

-0.02

0.28±0.05

PCB Mount Orientation

5

5

Request Samples

and Quotation

12

3 4

4

3

2

1

A

1

B

C

D

2

3

E

F

G

H

67

8

C

4

5

3rd Angle Projection

Units:

Metric (mm)

Tolerances (Except as Noted)

X.X ± 0.4

X.XX ± 0.25

X.XXX ± 0.05

Length

Angle

Product Description

This drawing is confidential and

copyright of Global Connector

Technology, Ltd (GCT).

This drawing must not be copied

or disclosed without written

consent. E & OE

Not to

Scale

Drawn By

SA

Sheet No.

1/2

USB3070

Micro USB Receptacle, Type B, Mid-Mount SMT,

Right Angled, Bottom Mount, 1.00mm Offset, Without Peg

CC

USB3070

E PCN

E4

By

Detail

Revision

Part Number

Drawing Date

4th April 2011

05/12/17

Date

X.X° ± 2°

X.XX° ± 1°

X.XXX° ± 0.5°

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