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LM2005 Datasheet(PDF) 16 Page - Texas Instruments

Part # LM2005
Description  LM2005 107-V, 0.5-A, 0.8-A Half-Bridge Driver with 8-V UVLO and Integrated Bootstrap Diode
PDF  32 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LM2005 Datasheet(HTML) 16 Page - Texas Instruments

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PQC = VGVDD × IGVDD + (VGVDD – VF) × IBST = 12V × 0.43mA + (12V – 0.6V) × 0.15mA = 6.87mW
(11)
2. Level-shifter losses, PIBSTS, due high-side leakage current IBSTS is shown in Equation 12.
PIBSTS = VBST × IBSTS × D = 72V × 0.033mA × 0.95 = 2.26mW
(12)
where
• D is the high-side switch duty cycle
3. Dynamic losses, PQG1&2, due to the FETs gate charge QG as shown in Equation 13.
PQG1&2=2×VGVDD×QG×fSW× RGD_R
RGD_R+RGATE+RGFET_INT= 2×12V×17nC×50kHz× 5.25Ω
5.25Ω+4.7Ω+2.2Ω
=8.8mW
(13)
where
• QG = Total FETs gate charge
• fSW = Switching frequency
• RGD_R = Average value of pullup and pulldown resistor
• RGATE = External gate drive resistor
• RGFET_INT = Internal FETs gate resistor
4. Level-shifter dynamic losses, PLS, during high-side switching due to required level-shifter charge on each
switching cycle. For this example it is assumed that value of parasitic charge QP is 2.5 nC, as shown in
Equation 14.
PLS = VBST × QP × fSW = 72V × 2.5nC × 50kHz = 9mW
(14)
In this example, the sum of all the losses is 27 mW as a total gate driver loss. For gate drivers that include
bootstrap diode, one should also estimate losses in the bootstrap diode. Diode forward conduction loss is
computed as product of average forward voltage drop and average forward current.
Equation 15 estimates the maximum allowable power loss of the device for a given ambient temperature.
PMAX=TJ−TARθJA
(15)
where
• PMAX = Maximum allowed power dissipation in the gate driver device
• TJ = Junction temperature
• TA = Ambient temperature
• RθJA = Junction-to-ambient thermal resistance
The thermal metrics for the driver package is summarized in the Thermal Information table of the data sheet.
For detailed information regarding the thermal information table, refer to the Texas Instruments application note
entitled Semiconductor and IC Package Thermal Metrics.
LM2005
SNVSCB6B – FEBRUARY 2023 – REVISED SEPTEMBER 2023
www.ti.com
16
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