5 Side conformal shield

Land side component

Compartment shield

(wire cage, wire fence, vertical wire)

A

B

Top mold (MUF)

PCB (core, coreless)

Bottom mold (MUF)

Protruded BGA

Laser ablation &

reflow (protruded ball)

C

D

E

F

G

H

A

B

C

D

E

F

H

G

With the rise of 5G, cellular frequency bands have increased considerably,

requiring innovative solutions for the packaging of RF front-end modules for

smartphones and other 5G-enabled devices. Amkor’s DSMBGA is the leading

example of such solutions. Expanding on years of experience in delivering

world-class advanced System in Package (SiP) technology, Amkor was the first

OSAT to offer DSMBGA and continues to pave the way for further breakthroughs.

This growing number of new frequencies combined with a variety of

multiplexing methods significantly increase the complexity of the RF front-end.

Integration using SiP allows customers to design, tune and test RF subsystems,

allowing for a reduction in design iterations and an accelerated time-to-market.

Amkor’s double-sided packaging technology has vastly increased the level of

integration for RF front-end modules used in smartphones and other mobile

devices. Common RF front-end modules consist of a low noise amplifier (LNA),

power amp, RF switch, RF filters and duplexers.

Amkor’s advanced SiP design rules and innovative DSMBGA technology enable

the integration of additional components – such as antenna tuners and passive

components. This creates the most advanced and compact RF front-end

module on the market today.

With additional power amplification and filtering circuitry, DSMBGA improves

signal integrity and reduces losses, resulting in improvement of Rx/Tx

amplification performance – which translates into reduced system power

requirements.

Amkor also applies state-of-the-art conformal and compartmental shielding

for EMI isolation and attenuation, as well as implements in-line RF testing to

deliver the most robust and cost-effective assembly technology in the industry.

To continue to improve the integration and robustness of RFFE

solutions, Amkor has developed a Double Sided Molded Ball

Grid Array (DSMBGA) package which allows molded assembly of

components on both sides of the substrate.

DSMBGA

DATA SHEET | LAMINATE PRODUCTS

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the

use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible

for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license

is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond

that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product

and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor

Technology, Inc. All other trademarks mentioned are property of their respective companies.

© 2021 Amkor Technology, Incorporated. All Rights Reserved. DS841A-EN Rev Date: 08/21

Visit amkor.com or email sales@amkor.com for more information.

DSMBGA CONSIDERATIONS

Allows molded assembly of

active, passive and antenna tuner

components on both sides of the

substrate, along with compartmental

or conformal shielding.

ADVANTAGES

f

Increased integration for RFFE

modules with significantly reduced

package height

f

Allows integration of antenna tuners

and passive components

f

Improves signal integrity and reduces

losses

f

Conformal and compartmental

shielding for EMI isolation

f

In-line RF testing