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EMIF02-MIC03F2 Datasheet(PDF) 5 Page - STMicroelectronics |
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EMIF02-MIC03F2 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 6 page ![]() EMIF02-MIC03F2 5/6 ® PACKAGE MECHANICAL DATA FLIP CHIP FOOT PRINT RECOMMENDATIONS MARKING 1.07mm ± 50µm 315µm ± 50 500µm ± 10 250µm ± 10 650µm ± 50 Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 300µm copper pad diameter x y x w z w Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E |
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