M95160-R datasheet(39/45 Pages) STMICROELECTRONICS

39 / 45 page

M95160, M95080

Package mechanical data

39/45

Figure 19.

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, package outline

Drawing is not to scale.

The central pad (the area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 25.

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, package mechanical data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

0.55

0.45

0.6

0.0217

0.0177

0.0236

0.02

0.05

0.0008

0.002

0.25

0.2

0.3

0.0098

0.0079

0.0118

1.9

2.1

0.0787

0.0748

0.0827

1.6

1.5

1.7

0.063

0.0591

0.0669

2.9

3.1

0.1181

0.1142

0.122

0.2

0.1

0.3

0.0079

0.0039

0.0118

0.5

0.0197

0.45

0.4

0.5

0.0177

0.0157

0.0197

0.15

0.0059

0.3

0.0118

ddd(2)

Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.08

UFDFPN-01

ddd

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