TOP209 datasheet(15/16 Pages) POWERINT

15 / 16 page

8/97

TOP209/210

PI-2076-041101

P08A

DIP-8

D S .004 (.10)

-E-

-D-

-F-

DIM

inches

0.370-0.385

0.245-0.255

0.125-0.135

0.015-0.040

0.120-0.135

0.060 (NOM)

0.014-0.022

0.010-0.012

0.090-0.110

0.030 (MIN)

0.300-0.320

0.300-0.390

0.300 BSC

9.40-9.78

6.22-6.48

3.18-3.43

0.38-1.02

3.05-3.43

1.52 (NOM)

0.36-0.56

0.25-0.30

2.29-2.79

0.76 (MIN)

7.62-8.13

7.62-9.91

7.62 BSC

Notes:

1. Package dimensions conform to JEDEC

specification MS-001-AB for standard dual

in-line (DIP) package .300 inch row spacing

(PLASTIC) 8 leads (issue B, 7/85)..

2. Controlling dimensions are inches.

3. Dimensions shown do not include mold

flash or other protrusions. Mold flash or

protrusions shall not exceed .006 (.15) on

any side.

4. D, E and F are reference datums on the

molded body.

PI-2077-042601

G08A

SMD-8

D S .004 (.10)

-E-

-D-

-F-

DIM

inches

0.370-0.385

0.245-0.255

0.125-0.135

0.004-0.012

0.036-0.044

0.060 (NOM)

0.048-0.053

0.032-0.037

0.007-0.011

0.010-0.012

0.100 BSC

0.030 (MIN)

0.372-0.388

0-8

9.40-9.78

6.22-6.48

3.18-3.43

0.10-0.30

0.91-1.12

1.52 (NOM)

1.22-1.35

0.81-0.94

0.18-0.28

0.25-0.30

2.54 BSC

0.76 (MIN)

9.45-9.86

0-8

Notes:

1. Package dimensions conform to JEDEC

specification MS-001-AB (issue B, 7/85)

except for lead shape and size.

2. Controlling dimensions are inches.

3. Dimensions shown do not include mold

flash or other protrusions. Mold flash or

protrusions shall not exceed .006 (.15) on

any side.

4. D, E and F are reference datums on the

molded body.

.004 (.10)

.010 (.25) M A S

Heat Sink is 2 oz. Copper

As Big As Possible

.420

.046 .060

.060 .046

.080

Pin 1

.086

.186

.286

Solder Pad Dimensions

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