AX2000 datasheet(16/262 Pages) MICROSEMI

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Detailed Specifications

2- 2

R ev isio n 1 8

Calculating Power Dissipation

Table 2-3 • Standby Current

Device

Temperature

ICCA

ICCDA

ICCBANK

ICCPLL

ICCCP1

IIH, IIL,

IOZ2

Units

Standby

Current

(Core)

Standby

Current,

Differential

I/O

Standby Current

per

I/O Bank

Standby

Current

per PLL

Standby Current,

Charge Pump

2.5 V

VCCI

3.3 V

VCCI

Active

Bypassed

Mode

AX125

Typical at 25°C

1.5

0.2

0.3

0.2

0.3

0.01

±0.01

70°C

0.5

0.75

0.4

0.01

±0.01

85°C

0.6

0.8

0.4

0.2

±0.01

125°C

1.5

0.4

0.5

±0.01

AX250

Typical at 25°C

1.5

1.4

0.25

0.4

0.2

0.3

0.01

±0.01

70°C

0.8

0.9

0.4

0.01

±0.01

85°C

0.8

0.4

0.2

±0.01

125°C

1.3

1.8

0.4

0.5

±0.01

AX500

Typical at 25°C

1.4

0.4

0.75

0.2

0.3

0.01

±0.01

70°C

1.5

0.4

0.01

±0.01

85°C

1.9

0.4

0.2

±0.01

125°C

180

1.75

2.5

1.5

0.4

0.5

±0.01

AX1000

Typical at 25°C

7.5

1.5

0.5

1.25

0.2

0.3

0.01

±0.01

70°C

1.5

0.4

0.01

±0.01

85°C

120

1.5

3.4

0.4

0.2

±0.01

125°C

200

1.5

0.4

0.5

±0.01

AX2000

Typical at 25°C

1.6

0.7

1.5

0.2

0.3

0.01

±0.01

70°C

160

0.4

0.01

±0.01

85°C

200

0.4

0.2

±0.01

125°C

500

1.5

0.4

0.5

±0.01

Notes:

1. ICCCP Active is the ICCDA or the Internal Charge Pump current. ICCCP Bypassed mode is the External Charge Pump

current IIH (VPUMP pin).

2. IIH, IIL, or IOZ values are measured with inputs at the same level a

s VCCI for IIH and GND for IIL and IOZ.

AX2000 Datasheet(PDF) 16 Page - Microsemi Corporation

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