LPV1500 datasheet(2/2 Pages) FILTRONIC

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Filtronic

LPV1500

Solid State

1 W Power PHEMT

Phone: (408) 988-1845

Internet: http://www.filtronicsolidstate.com

Fax: (408) 970-9950

ABSOLUTE MAXIMUM RATINGS

(25

°C)

RECOMMENDED CONTINUOUS

OPERATING LIMITS

SYMBOL

PARAMETER

RATING

SYMBOL

PARAMETER

RATING

VDS

Drain-Source Voltage

+12V

VDS

Drain-Source Voltage

+8V

VGS

Gate-Source Voltage

-5V

VGS

Gate-Source Voltage

-1V

IDS

Drain-Source Current

2 x IDSS

IDS

Drain-Source Current

0.8 x IDSS

Gate Current

70 mA

Gate Current

15 mA

RF Input Power

750 mW

RF Input Power

300 mW

TCH

Channel Temperature

+175

°C

TCH

Channel Temperature

+150

°C

TSTG

Storage Temperature

-65/175

°C

TSTG

Storage Temperature

-20/50

°C

Power Dissipation

3.33W

3,4

Power Dissipation

3.0 W

3,4

GXdB

Gain Compression

8 dB

NOTES:

1. Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.

2. Recommended Continuous Operating Limits should be observed for reliable device operation.

3. Power Dissipation defined as: PT ≡ (PDC + PIN) - POUT, where: PDC = DC bias power, POUT = RF output power, and

PIN = RF input power.

4. Power Dissipation to be de-rated as follows:

5. Specifications subject to change without notice.

Example #1:

VDS = 8V, IDS = 315 mA

PIN = POUT = 0 dBm (quiescent condition):

PT = PDC = 2.52W

Max. continuous THS = 37°C

Example #2:

VDS = 8V, IDS = 315 mA

PIN = 23 dBm POUT = 31 dBm

PT = (2.52+0.2) - 1.26 = 1.46W

Max. continuous THS = 84°C

HANDLING PRECAUTIONS:

PHEMT chips should be stored in a dry nitrogen environment until assembly. Care should be exercised during handling to

avoid damage to the devices. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of

storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500V), and further information

on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.

ASSEMBLY INSTRUCTIONS:

The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-

290

°C; maximum time at temperature is 1 min. The recommended wire bond method is thermo-compression wedge

bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260

°C.

APPLICATIONS NOTES AND DESIGN DATA:

Applications Notes are available from your local FSS Sales Representative, or directly from the factory. Complete design

data, including S-parameters, Noise data, and Large-Signal models, is available on 3.5” diskette, or may be down-loaded

from our Web Page.

DSS-041 WA

THS(

oC)

-22-22 mW/

mW/

-24 mW/

PT(W)

3.33

3.0

150

175

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