SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N0177, Rev. A

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

MBRF3060CT

Electrical Characteristics:

Characteristics

Symbol

Condition

Max.

Units

Max. Forward Voltage Drop

(per leg)*

0.70

V

0.67

V

Max. Reverse Current (per

leg)*

1.0

mA

100

mA

Max. Junction Capacitance

(per leg)

°C

700

pF

Typical Series Inductance

(per leg)

Measured lead to lead 5 mm from

package body

8.0

nH

Max. Voltage Rate of Change

dv/dt

-

10,000

V/

µs

Clip mounting, the epoxy body

away from the heatsink edge by

more than 0.110" along the lead

direction.

4500

Clip mounting, the epoxy body is

inside the heatsink.

3500

RSM Isolation Voltage

(t = 1.0 second, R. H. < =30%,

Screw mounting, the epoxy body

is inside the heatsink.

1500

V

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Max. Junction Temperature

-

-55 to +150

°C

Max. Storage Temperature

-

-55 to +150

°C

Maximum Thermal

Resistance Junction to Case

DC operation

3.0

°C/W

Maximum Thermal

Resistance, Case to Heat

Sink

DC operation

60

°C/W

Approximate Weight

wt

-

2

g

Case Style

ITO-220AB