LP5523_16 datasheet(3/56 Pages) TI1

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LP5523

www.ti.com

SNVS550D – SEPTEMBER 2009 – REVISED MAY 2013

PIN DESCRIPTIONS(1) (continued)

Name

Type

Description

CLK

32 kHz clock input. Connect to ground if not used

GND

Ground

Current source output 9.

Note: powered from VDD

GPO

General purpose output. Leave unconnected if not used

TRIG

I/OD

Trigger. Connect to ground if not used

SDA

I/OD

Serial interface data

SCL

Serial interface clock

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

VDD

−0.3V to +6.0V

Voltage on D1 to D9, C1

−, C1+,

−0.3V to VDD +0.3V

−, C2+, VOUT

with 6.0V max

Continuous Power Dissipation (4)

Internally Limited

Junction Temperature (TJ-MAX)

125°C

Storage Temperature Range

−65°C to +150°C

Maximum Lead Temperature (Soldering)

(5)

ESD Rating

Human Body Model: D1 to D9

8kV (6)

Human Body Model: All Other Pins

2.5kV (6)

Machine Model: All Pins

250V (7)

Charge Device Model: All Pins

1000V (8)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

All voltages are with respect to the potential at the GND pin.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 130°C (typ.).

(5)

For detailed soldering specifications and information, please refer to STET Application Note AN1112 : DSBGA Wafer Level Chip Scale

Package SNVA009.

(6)

Human Body Model, applicable standard JESD22-A114C

(7)

Machine Model, applicable standard JESD22- A115-A

(8)

Charge Device Model, applicable standard JESD22A-C101

Recommended Operating Conditions

(1) (2)

VDD Input Voltage Range

2.7V to 5.5V

Voltage on Logic Pins

(Input or Output Pins)

0 to VDD

Recommended Charge Pump Load Current

0 mA to 100 mA

Junction Temperature (TJ) Range

−30°C to +125°C

Ambient Temperature (TA) Range

(3)

−30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

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