STPS052Z datasheet(3/5 Pages) STMICROELECTRONICS

3 / 5 page

STPS0520Z

3/5

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.00

0.05

0.10

0.15

0.20

0.25

IF(av) (A)

PF(av)(W)

δ=tp/T

δ = 0.05 δ = 0.1 δ = 0.2

δ = 0.5

δ = 1

Fig. 1: Average forward power dissipation versus

average forward current

100

125

0.0

0.1

0.2

0.3

0.4

0.5

0.6

Tamb(°C)

IF(av)(A)

δ=tp/T

Fig. 2: Average forward current versus ambient

temperature (

δ = 0.5)

1E-3

1E-2

1E-1

1E+0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

t(s)

IM(A)

Ta=25°C

Ta=50°C

Ta=75°C

δ=0.5

Fig. 3: Non repetitive surge peak forward current

versus overload duration (maximum values).

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

1E-3

1E-2

1E-1

1E+0

tp(s)

Zth(j-a)/Rth(j-a)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

δ=tp/T

Fig. 4: Relative variation of thermal impedance

junction to ambient versus pulse duration (Epoxy

printed circuit board FR4 with recommended pad

layout).

1012

14161820

1E-3

1E-2

1E-1

1E+0

1E+1

2E+1

VR(V)

IR(mA)

Tj=70°C

Tj=25°C

Tj=100°C

Tj=125°C

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

100

125

1E-1

1E+0

1E+1

1E+2

1E+3

Tj(°C)

IR[Tj] / IR[Tj=25°C]

VR=VRRM

Fig. 6: Relative variation of reverse leakage cur-

rent versus junction temperature (typical values).

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