1103

Potter & Brumfield

Dimensions are shown for

reference purposes only.

Dimensions are in inches

over (millimeters) unless

otherwise specified.

Catalog 1308242

Issued 3-03 (PDF Rev. 03-16)

Specifications and availability

subject to change.

www.tycoelectronics.com

Technical support:

Refer to inside back cover.

1103

Dimensions are in inches

over (millimeters) unless

otherwise specified.

Specifications and availability

subject to change.

Operating Diagrams

Outline Dimensions

1.70

[ 43.2 ]

1.88

[ 47.8 ]

1.00

[ 25.4 ]

1.10

[ 27.9 ]

.49

[ 12.4 ]

.38

[ 9.5 ]

.33

[ 8.3 ]

1.75

[ 44.5 ]

.89

[ 22.6]

.13

[ 3.2 ]

2.25

[ 57.2 ]

.85

[ 21.5 ]

.92

[ 23.3 ]

6-32 TERMINAL & SCREWS

(2 PLACES)

8-32 TERMINAL & SCREWS

(2 PLACES)

.19

[4.9]

MOUNTING

HOLE/SLOT

LED INDICATOR

Output Specification (@ 25°C, unless otherwise specified)

Electrical Characteristics (Thermal Derating Curves)

*See Derating Curves

Parameter

Conditions

Units

Load Voltage Range V

Repetitive Blocking Voltage (Min.)

Thermal Resistance, Junction to Case

(R

) (Max.)

I t Rating

A Sec.

V rms

C/W

V/s

ms

ms

Turn-Off Time (Max.)

I = Max.

θ

2

Turn-On Time (Max.)

L

L

24 - 280

0.5 - 1.0

SSRT-240A10

& SSRT-240D10

SSRT-240A25

& SSRT-240D25

Single Cycle Surge Current (Min.)

Load Current Range I *

Leakage Current (Off-State) (Max.)

Static dv/dt (Off-State) (Min.)

Load Power Factor Rating

L

t = 8.3 ms

2

f = 60 Hz.

f = 60 Hz.

I = Max.

L

f = 60 Hz. V = Nom.

(120 or 240 V rms)

V peak

A rms

A peak

mA rms

On-State Voltage Drop (Max.)

V peak

500

.1

8.3 for DC input types, 20 for AC input types

100

250

.1 - 10

.1 - 25

- 600

8.3 for DC input types, 30 for AC input types

41

240

L

2.2

1.7

j-c

Resistive

1.5

1.3

Heatsink Recommendations

• We recommend that solid state relay modules be mounted to a heatsink sufficient to maintain the module’s base temperature at less than 85°C

under worst case ambient temperature and load conditions.

• The heatsink mounting surface should be a smooth (30-40 micro-inch finish), flat (30-40 micro-inch flatness across mating area), un-painted surface

which is clean and free of oxidation.

• An even coating of thermal compound (Dow Corning DC340 or equivalent) should be applied to both the heatsink and module mounting surfaces

and spread to a uniform depth of .002” to eliminate all air pockets.

• The module should be mounted to the heatsink using two#10 screws.

10A Units

25A Units