TDA2824 datasheet(8/10 Pages) STMICROELECTRONICS

8 / 10 page

MOUNTING INSTRUCTION

The Rth j-amb of the TDA2824 can be reduced by sol-

dering the GND pins to a suitable copper area of the

printed circuit board (Figure 13) or to an external

heatsink (Figure 14).

The diagram of Figure 15 shows the maximum dis-

sipable power Ptot and the Rth j-amb as a function of

the side”

∂” oftwoequalsquarecopper areashaving

a thickness of 35

µ (1.4 mils).

During soldering the pins temperature must not ex-

ceed 260

°C and the soldering time must not be

longer than 12 seconds.

The external heatsink or printed circuit copper area

must be connected to electrical ground.

Figure 13 : Example of P.C. Board Copper Area

which is used as Heatsink.

Figure 14 : External Heatsink Mounting Example.

Figure 15 : Maximum Dissipable Power and

Junction to Ambient Thermal

Resistance vs. Side ”

∂”.

Figure 16 : Maximum Allowable Power Dissipa-

tion vs. Ambient Temperature.

TDA2824

8/10

TDA2824 Datasheet(PDF) 8 Page - STMicroelectronics