Package mechanical data

MP33AB01H

10/13

DocID024171 Rev 3

Figure 6. Device footprint and PCB land pattern

d

0.150

0.0059

K

0.050

0.0020

Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions (continued)

Symbol

mm.

inch.

Min.

Typ.

Max.

Min.

Typ.

Max.