STM32F100RC datasheet(50/106 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32F100xC, STM32F100xD, STM32F100xE

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DocID15081 Rev 10

Low-speed external user clock generated from an external source

The characteristics given in Table 21 result from tests performed using an low-speed

external clock source, and under the ambient temperature and supply voltage conditions

summarized in Table 9.

Table 20. High-speed external user clock characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fHSE_ext

User external clock source

frequency(1)

1. Guaranteed by design, not tested in production.

MHz

VHSEH

OSC_IN input pin high level

voltage(1)

0.7VDD

-VDD

VHSEL

OSC_IN input pin low level

voltage(1)

VSS

-0.3VDD

tw(HSE)

OSC_IN high or low time(1)

tr(HSE)

tf(HSE)

OSC_IN rise or fall time(1)

Cin(HSE) OSC_IN input capacitance(1)

DuCy(HSE) Duty cycle(1)

-45

OSC_IN Input leakage current

VSS ≤VIN ≤VDD

±1

µA

Table 21. Low-speed external user clock characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fLSE_ext

User external clock source

frequency(1)

1. Guaranteed by design, not tested in production.

32.768

1000

kHz

VLSEH

OSC32_IN input pin high level

voltage(1)

0.7VDD

-VDD

VLSEL

OSC32_IN input pin low level

voltage(1)

VSS

-0.3VDD

tw(LSE)

OSC32_IN high or low time(1)

450

tr(LSE)

tf(LSE)

OSC32_IN rise or fall time(1)

Cin(LSE) OSC32_IN input capacitance(1)

-5

DuCy(LSE) Duty cycle(1)

OSC32_IN Input leakage current

VSS ≤VIN ≤VDD

±1

µA

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