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OVLGC0C6B9. Datasheet(PDF) 6 Page - TT Electronics.

Part # OVLGC0C6B9.
Description  High-Intensity LED in Plastic T-1쩐 Package
PDF  6 Pages
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Manufacturer  TTELEC [TT Electronics.]
Direct Link  http://www.ttelectronics.com/
Logo TTELEC - TT Electronics.

OVLGC0C6B9. Datasheet(HTML) 6 Page - TT Electronics.

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High-Intensity LED in Plastic
T-1¾ Package
OVLGx0CyB9 Series
© TT electronics plc
Issue D 08/2017
Page 6
TT Electronics | Optek Technology, Inc.
1645 Wallace Drive, Ste. 130, Carrollton, TX USA 75006 |Ph: +1 972 323 2200
www.ttelectronics.com | sensors@ttelectronics.com
General Note
TT Electronics reserves the right to make changes in product specification without
notice or liability. All information is subject to TT Electronics’ own data and is
considered accurate at time of going to print.
Symbol
Test Conditions
Criteria for Judgment
Test Item
Min.
Max
Luminous Intensity
IV
IF = 20mA
LSLx0.7 **
Forward Voltage
VF
IF = 20mA
USLx1.1 *
2. Failure Criteria (TA = 25°C):
( * ) USL: Upper Standard Level, ( ** ) LSL: Lower Standard Level
Reliability Test
LED lamps are checked by reliability tests based on MIL standards.
1. Test Conditions, Acceptable Criteria & Results
Classification
Test Item
Std. Test
Method
Test Conditions
Duration Unit
Acc / Rej
Criteria
Result
Life Test
Operation Life Test
(OLT)
MIL-STD-750D
Method 1026.3
TA=25°C , IF=30mA *
1000 Hrs
100
0 / 1
Pass
High Temperature
Storage (HTS)
MIL-STD-750D
Method 1032.1
TA=100°C
1000 Hrs
100
0 / 1
Pass
Low Temperature
Storage (LTS)
MIL-STD-750D
Method 1032.1
TA=—40°C
1000 Hrs
100
0 / 1
Pass
Temp. & Humidity
with Bias (THB)
MIL-STD-750D
Method 103B
TA=85°C , Rh=85%
IF=20mA
500 Hrs
100
0 / 1
Pass
Thermal Shock Test
(TST)
MIL-STD-750D
Method 1056.1
0°C
~
100°C
2min
2min
100 cycles
100
0 / 1
Pass
Temperature Cy-
cling Test (TCT)
MIL-STD-750D
Method 1051.5
-40°C ~ 25°C ~ 100°C ~ 25°C
30min 5min 30min 5min
100 cycles
100
0 / 1
Pass
Solderability
MIL-STD-750D
Method 2026.4
235±5°C , 5 sec.
1 time
20
0 / 1
Pass
Resistance to Sol-
dering Heat
MIL-STD-750D
Method 2031.1
260±5°C , 5 sec.
1 time
20
0 / 1
Pass
Lead Integrity
MIL-STD-750D
Method 2036.3
Load 2.5N (0.25kgf)
0°~90°~0° , bend
3 times
20
0 / 1
Pass
Remark: ( * ) IF = 30mA for AllnGaP chip; IF = 20mA for InGan chip
( ** ) IF = 20mA for AllnGaP chip; IF = 10mA for InGan chip



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