High Isolation GaAs MMIC Doubler

MMD-1648L

Page 2

Copyright © 2019 Marki Microwave, Inc. | Rev. A

1. CH Substrate material is .004 thick GaAs.

2. I/O traces and ground plane finish are 2 microns Au.

3. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage

temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the

minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or

substrate. All bonds should be as short as possible <0.31 mm (12 mils).

F

2F

F

F 2F 3F 4F

IN

OUT

Suppression