ICS83905AMLF datasheet(12/19 Pages) IDT

12 / 19 page

IDT™ / ICS™ LVCMOS/LVTTL FANOUT BUFFER

ICS83905AM REV. B JULY 9, 2007

ICS83905

LOW SKEW, 1:6 CRYSTAL-TO-LVCMOS/LVTTL FANOUT BUFFER

INPUTS:

LVCMOS CONTROL PINS

All control pins have internal pull-ups or pull-downs; additional

resistance is not required but can be added for additional

protection. A 1k

Ω resistor can be used.

RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS

OUTPUTS:

LVCMOS OUTPUTS

All unused LVCMOS output can be left floating. There should be

no trace attached.

EXPOSED PAD

Expose Metal Pad

(GROUND PAD)

GROUND PLANE

SOLDER

SIGNAL

TRACE

SIGNAL

TRACE

THERM AL VIA

SOLDER M ASK

FIGURE 4. P.C. BOARD FOR EXPOSED PAD THERMAL RELEASE PATH EXAMPLE

THERMAL RELEASE PATH

The expose metal pad provides heat transfer from the device to

the P.C. board. The expose metal pad is ground pad connected

to ground plane through thermal via. The exposed pad on the

device to the exposed metal pad on the PCB is contacted through

solder as shown in Figure 4. For further information, please refer

to the Application Note on Surface Mount Assembly of Amkor’s

Thermally /Electrically Enhance Leadframe Base Package, Amkor

Technology.

ICS83905AMLF Datasheet(PDF) 12 Page - Integrated Device Technology