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MSW3100-301-R Datasheet(PDF) 5 Page - M/A-COM Technology Solutions, Inc. |
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MSW3100-301-R Datasheet(HTML) 5 Page - M/A-COM Technology Solutions, Inc. |
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5 / 15 page ![]() SP3T PIN Diode Switch Rev. V1 MSW310x-310 5 5 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DS-xxxxxxx 5 Absolute Maximum Ratings Parameter Conditions Absolute Maximum Forward Current J1, J2, J3 port B1, B2, B3 port 250 mA 150 mA Reverse Voltage J1, J2, J3 port B1, B2, B3 port 125 V Forward Diode Voltage IF = 250 mA 1.2 V CW Incident Power Handling4 J0, J1, J2, J3 port Source & Load VSWR = 1.5:1, TC = 85°C, cold switching 50 dBm Peak Incident Power Handling4 J0, J1, J2, J3 port Source & Load VSWR = 1.5:1, TC = 85°C, cold switching, Pulse Width = 10 µs, Duty Cycle = 1% 57 dBm Total Dissipated RF & DC Power4 TC = 85°C, cold switching 5 W Junction Temperature — +175°C Operating Temperature — -65°C to +125°C Storage Temperature — -65°C to +150°C Assembly Temperature t = 10 s +260°C Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity These electronic devices are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these Class 1C (HBM) devices. The moisture sensitivity level (MSL) rating for this part is MSL 1. Environmental Capabilities The MSW204x-204 diode is capable of meeting the environmental requirements of MIL-STD-202 and MIL-STD-750. 4. Backside RF and DC grounding area of device must be completely solder attached to the RF circuit board vias for proper electrical and thermal circuit grounding. |
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