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MSW3100-301-R Datasheet(PDF) 5 Page - M/A-COM Technology Solutions, Inc.

Part # MSW3100-301-R
Description  SP3T PIN Diode Switch
PDF  15 Pages
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

MSW3100-301-R Datasheet(HTML) 5 Page - M/A-COM Technology Solutions, Inc.

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SP3T PIN Diode Switch
Rev. V1
MSW310x-310
5
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DS-xxxxxxx
5
Absolute Maximum Ratings
Parameter
Conditions
Absolute Maximum
Forward Current
J1, J2, J3 port
B1, B2, B3 port
250 mA
150 mA
Reverse Voltage
J1, J2, J3 port
B1, B2, B3 port
125 V
Forward Diode Voltage
IF = 250 mA
1.2 V
CW Incident Power Handling4
J0, J1, J2, J3 port
Source & Load VSWR = 1.5:1,
TC = 85°C, cold switching
50 dBm
Peak Incident Power Handling4
J0, J1, J2, J3 port
Source & Load VSWR = 1.5:1, TC = 85°C, cold switching,
Pulse Width = 10 µs, Duty Cycle = 1%
57 dBm
Total Dissipated RF & DC Power4
TC = 85°C, cold switching
5 W
Junction Temperature
+175°C
Operating Temperature
-65°C to +125°C
Storage Temperature
-65°C to +150°C
Assembly Temperature
t = 10 s
+260°C
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These
electronic
devices
are
sensitive
to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these Class 1C
(HBM) devices. The moisture sensitivity level (MSL)
rating for this part is MSL 1.
Environmental Capabilities
The MSW204x-204 diode is capable of meeting the
environmental requirements of MIL-STD-202 and
MIL-STD-750.
4. Backside RF and DC grounding area of device must be completely solder attached to the RF circuit board vias for proper electrical and
thermal circuit grounding.



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