3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®

3.1

TO-220AB insulated package information

•

Molding compound resin is halogen-free and meets UL standard level V0

•

Lead-free package leads finishing

•

ECOPACK®2 compliant

C

b2

c2

F

L

A

a1

a2

B

e

b1

I4

l3

l2

c1

M

Resin gate 0.5 mm

Resin gate 0.5 mm

(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites.

I

TN5015H-6I

Package information

DS12178 - Rev 3

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