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AS1109 Datasheet(PDF) 13 Page - ams AG |
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AS1109 Datasheet(HTML) 13 Page - ams AG |
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13 / 26 page ![]() www.austriamicrosystems.com Revision 1.18 13 - 26 AS1109 Data Sheet - D e t a i l e d D e s c r i p t i o n Detailed Error Reports The detailed error report can be read out after global error mode has been run. On the falling edge of LD, the detailed error report of the selected test is latched into the shift register and can be clocked out with n*8 clock cycles (n is the number of AS1109s in a chain) via pin SDO. At the same time new data can be written into the shift register, which will load on the next rising edge of pin LD. This data will show at the output drivers, at the falling edge of OEN. Detailed Temperature Warning Report The detailed temperature warning report can be read out immediately after global error mode has been run. Bit0 of the 8bit data word represents the temperature flag of the chip. Figure 15. Detailed Temperature Warning Report Timing Diagram Detailed Temperature Warning Report Example Consider a case where five AS1109s are cascaded in one chain. The detailed error report lists the temperatures for each device in the chain: IC1:[70°] IC2:[85°] IC3:[66°] IC4:[160°] IC5:[76°] In this case, IC4 is overheated and will generate a global error, and therefore 5*8 clock cycles are needed to write out the detailed temperature warning report, and optionally read in new data. The detailed temperature warning report would look like this: XXXXXXX1 XXXXXXX1 XXXXXXX1 XXXXXXX0 XXXXXXX1 The 0 in the detailed temperature warning report indicates that IC4 is the device with the over-temperature condition. Note: In an actual report there are no spaces in the output. Global Flag Readout Detailed Error Report Readout tH(L) tP4 tP4 SDI OEN LD CLK SDO New Data Input TFLAG DBit7 Undefined Don’t Care Don’t Care Temperature Error Report Output DBit6 DBit5 DBit4 DBit3 DBit2 DBit1 DBit0 TBit0 t(SU)ERROR tP1 For detailed timing information see Timing Diagrams on page 9. tGSW(ERROR) |
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