DAC3154

DAC3164

SLAS960 – MAY 2013

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ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

VDDA33 to GND

–0.5 to 4

VDDA18 to GND

–0.5 to 2.3

Supply voltage

CLKVDD18 to GND

–0.5 to 2.3

V

IOVDD to GND

–0.5 to 4

DIGVDD18 to GND

–0.5 to 2.3

CLKVDD18 to DIGVDD18

–0.5 to 0.5

VDDA18 to DIGVDD18

–0.5 to 0.5

D[11..0]P, D[11..0]N, DATACLKP, DATACLKN, SYNCP, SYNCN to GND

–0.5 to DIGVDD18 + 0.5

Terminal voltage

DACCLKP, DACCLKN, ALIGNP, ALIGNN

–0.5 to CLKVDD18 + 0.5

V

range

TXENABLE, ALARM, SDO, SDIO, SCLK, SDENB, RESETB to GND

–0.5 to IOVDD + 0.5

IOUTAP, IOUTAN, IOUTBP, IOUTBN to GND

–0.7 to 1.4

EXTIO, BIASJ to GND

–0.5 to VDDA33 + 0.5

Storage temperature range

–65 to 150

°C

ESD, Human Body Model

2

kV

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

DAC3174

UNITS

QFN (64 PIN)

Junction-to-ambient thermal resistance

23.0

Junction-to-case (top) thermal resistance

7.6

Junction-to-board thermal resistance

2.8

°C/W

Junction-to-top characterization parameter

0.1

Junction-to-board characterization parameter

2.8

Junction-to-case (bottom) thermal resistance

0.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

8

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