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AA035P3-00 Datasheet(PDF) 1 Page - Alpha Industries |
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AA035P3-00 Datasheet(HTML) 1 Page - Alpha Industries |
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1 / 2 page ![]() Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com 1 Specifications subject to change without notice. 1/01A 31–35 GHz GaAs MMIC Driver Amplifier Features s Single Bias Supply Operation (5 V) s 19 dB Typical Small Signal Gain s 17 dBm Typical P1 dB Output Power at 35 GHz s 0.25 µm Ti/Pd/Au Gates s 100% On-Wafer RF and DC Testing s 100% Visual Inspection to MIL-STD-883 MT 2010 Chip Outline AA035P3-00 Description Alpha’s three-stage reactively-matched Ka band GaAs MMIC driver amplifier has a typical P1 dB of 17 dBm with 18 dB associated gain at 35 GHz. The chip uses Alpha’s proven 0.25 µm MESFET technology, which is based upon MBE layers and electron beam lithography for the highest uniformity and repeatability. The FETs employ surface passivation to ensure a rugged, reliable part with through-substrate via holes and gold-based backside metallization to facilitate solder or epoxy die attach processes. The amplifier is a self-bias design requiring a single positive drain bias to one of any three bonding sites. All chips are screened for S-parameters prior to shipment for guaranteed performance. A broad range of applications exist in both the high reliability and commercial areas where high gain and power are required. Parameter Condition Symbol Min. Typ.3 Max. Unit Drain Current IDS 275 350 mA Small Signal Gain F= 31–35 GHz G 15 19 dB Noise Figure1 F= 35 GHz NF 10.5 dB Input Return Loss F= 31–35 GHz RLI -14 -10 dB Output Return Loss F= 31–35 GHz RLO -16 -10 dB Output Power at 1 dB Gain Compression F= 35 GHz P1 dB 15 17 dBm Saturated Output Power F= 35 GHz PSAT 16 19 dBm Thermal Resistance2 ΘJC 66 °C/W Electrical Specifications at 25°C (VDS = 5 V) 1. Not measured on a 100% basis. 2. Calculated value based on measurement of discrete FET. 3. Typical represents the median parameter value across the specified frequency range for the median chip. 0.000 1.250 1.905 Dimensions indicated in mm. All DC (V) pads are 0.1 x 0.1 mm and RF In, Out pads are 0.07 mm wide. Chip thickness = 0.1 mm. Characteristic Value Operating Temperature (TC) -55°C to +90°C Storage Temperature (TST) -65°C to +150°C Bias Voltage (VD)7 VDC Power In (PIN) 19 dBm Junction Temperature (TJ) 175°C Absolute Maximum Ratings |
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