BGA3012

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Product data sheet

Rev. 3 — 26 September 2013

8 of 15

NXP Semiconductors

BGA3012

1 GHz 12 dB gain wideband amplifier MMIC

8.1.2 Forward application circuit board layout

PCB (Printed-Circuit Board) material = FR4; thickness = 1.5 mm; size = 40 mm

 40 mm; 

layer = 35

m;

Components are listed in Table 11.

Fig 2.

BGA3012 application circuit board layout

Table 11.

List of components

See Figure 1 and Figure 2.

Component

Description

Value

Size

Remarks

C1, C2, C3, C4

capacitor

10 nF

SMD 0402

Murata GRM155R71E103KA01D or capacitor of same quality

C5

capacitor

100 pF

SMD 0402

Murata GRM1555C1H101JZ01D or capacitor of same quality

J1, J2

F-connector

75



-

Bomar 861V509ER6 or F-connector of same quality

J3

header 3-way

-

-

Molex 90121-0763 or header of the same quality

L1, L3

inductor

3.9 nH

SMD 0402

Murata LQG15HS3N9S02D or inductor of same quality

L2

choke

-

SMD 0603

Murata BLM18HD182SN1D or choke of same quality

L4

inductor

880 nH

SMD 1206

Murata LQH31HNR88K03L or inductor of same quality

R1

resistor

100



SMD 0402

Yageo RC0402FR-07100RL or resistor of same quality

R2

resistor

300



SMD 0402

Yageo RC0402FR-07300RL or resistor of same quality

U1

BGA3012

-

-

NXP