Ver 2.6

Nov 06, 2013

TEL: 886-3-5788833

http://www.gmt.com.tw

1

G546

Global Mixed-mode Technology

Dual Power Distribution Switch

Features

87m

Ω R

Available with 5 Versions of Current Limits with

Foldback

Operating Range:2.7V to 5.5V

400µS Typical Rise Time

Under voltage Lockout

65µA Quiescent Supply Current

1µA Maximum Shutdown Supply Current

Logic Level Enable Pin, Available with

Active-High or Active-Low Version

No Reverse Current when Power Off

Deglitched Open-Drain Over-Current Flag

Output (

SOP-8 Package,MSOP-8 , MSOP-8 (FD) and

TDFN3X3-8 Package

UL Approved_#E232223

Nemko IEC 60950-1 CB/CCA_scheme Certifi-

cation Report #67291

Applications

High-Side Power Protection Switch

USB Power Management

USB Host and Self-Powered Bubs

USB Bus-Powered Hubs

Hot Plug-In Power Supplies

Battery-Charger Circuits

General Description

The G546 are integrated dual channel 87m

Ω (G546X1,

G546X2) and 72m

Ω (G546X3, G546X4) power

switchs for self-powered and bus-powered Universal

Serial Bus (USB) applications.

Several Protection features include current limiting

with foldback, and thermal shutdown to prevent catas-

trophic switch failure caused by increasing power dis-

sipation when continuous heavy loads or short circuit

occurs. And a built-in charge pump is used to drive the

N-channel MOSFET that is free of parasitic body diode

to eliminate any reversed current flow across the

switch when it is powered off.

over-temperature event and has typical 9ms deglitch

timeout period.

Pin Configuration

Typical Application Circuit

R

UL Recognized Component

R

UL Recognized Component

Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation.

22µF

Load

OC1

EN1 (EN1)

OC2

EN2 (EN2)

22µF

Load

22µF

Power Supply

2.7V to 5.5V

OUT1

OUT2

IN

SOP-8/MSOP-8

G546

8

6

5

OC1

7

OUT1

OUT2

OC2

G546

TDFN3X3-8

1

2

3

4

8

7

6

5

Thermal

Pad

OC1

OUT1

OUT2

OC2

GND

EN1(EN1)

IN

EN2 (EN2)

1

2

3

4

GND

EN1(EN1)

IN

EN2 (EN2)

If the PCB trace of power rail to IN is long, larger input capacitor is necessary.

*

G546

8

6

5

1

2

3

4

MSOP-8 (FD)

G546

7

Thermal

Pad

GND

EN1(EN1)

IN

EN2 (EN2)

OC1

OUT1

OUT2

OC2

Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation.

22µF

Load

OC1

EN1 (EN1)

OC2

EN2 (EN2)

22µF

Load

22µF

Power Supply

2.7V to 5.5V

OUT1

OUT2

IN

SOP-8/MSOP-8

G546

8

6

5

OC1

7

OUT1

OUT2

OC2

G546

TDFN3X3-8

1

2

3

4

8

7

6

5

Thermal

Pad

OC1

OUT1

OUT2

OC2

GND

EN1(EN1)

IN

EN2 (EN2)

1

2

3

4

GND

EN1(EN1)

IN

EN2 (EN2)

If the PCB trace of power rail to IN is long, larger input capacitor is necessary.

*

G546

8

6

5

1

2

3

4

MSOP-8 (FD)

G546

7

Thermal

Pad

GND

EN1(EN1)

IN

EN2 (EN2)

OC1

OUT1

OUT2

OC2