DMN2020UFCL datasheet(2/6 Pages) DIODES

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DMN2020UFCL

Document number: DS36541 Rev. 3 – 2

2 of 6

www.diodes.com

December 2013

DMN2020UFCL

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Units

Drain-Source Voltage

VDSS

Gate-Source Voltage

VGSS

±10

Continuous Drain Current (Note 6) VGS = 4.5V

Steady

State

TA = +25°C

TA = +70°C

7.1

Pulsed Drain Current (Note 7)

IDM

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 5)

0.61

Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5)

RθJA

205

°C/W

Power Dissipation (Note 6)

2.0

Thermal Resistance, Junction to Ambient @TA = +25°C (Note 6)

RθJA

°C/W

Operating and Storage Temperature Range

TJ, TSTG

-55 to +150

°C

Electrical Characteristics N-CHANNEL – Q1 (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 8)

Drain-Source Breakdown Voltage

BVDSS

—

VGS = 0V, ID = 250μA

Zero Gate Voltage Drain Current TJ = +25°C

IDSS

—

1.0

μA

VDS = 16V, VGS = 0V

Gate-Source Leakage

IGSS

—

μA

VGS = ±8V, VDS = 0V

ON CHARACTERISTICS (Note 8)

Gate Threshold Voltage

VGS(th)

0.4

—

0.9

VDS = VGS, ID = 250μA

Static Drain-Source On-Resistance

RDS (ON)

—

mΩ

VGS = 4.5V, ID = 9A

VGS = 2.5V, ID = 7.5A

VGS = 1.8V, ID = 7A

Diode Forward Voltage

VSD

—

0.7

1.2

VGS = 0V, IS = 1.6A

DYNAMIC CHARACTERISTICS (Note 9)

Input Capacitance

Ciss

—

1788

—

VDS = 10V, VGS = 0V,

f = 1.0MHz

Output Capacitance

Coss

—

162

—

Reverse Transfer Capacitance

Crss

—

150

—

Gate Resistance

—

1.36

—

Ω

VDS = 0V, VGS = 0V, f = 1MHz

Total Gate Charge

—

21.5

—

VGS = 4.5V, VDS = 10V,

ID = 3A

Gate-Source Charge

Qgs

—

2.2

—

Gate-Drain Charge

Qgd

—

2.3

—

Turn-On Delay Time

tD(on)

—

3.8

—

VDD = 10V, VGS = 4.5V, ID = 4A

RG = 2Ω

Turn-On Rise Time

—

5.7

—

Turn-Off Delay Time

tD(off)

—

Turn-Off Fall Time

—

6.8

—

Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.

7. Repetitive rating, pulse width limited by junction temperature.

8. Short duration pulse test used to minimize self-heating effect.

9. Guaranteed by design. Not subject to product testing.

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