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HT2MOA3S20/E/3 Datasheet(PDF) 10 Page - NXP Semiconductors |
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HT2MOA3S20/E/3 Datasheet(HTML) 10 Page - NXP Semiconductors |
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10 / 22 page ![]() Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19 Ht2moa3.doc/HS Page 10 of 22 4 Coil Specifications The HITAG 2 chip module has to be connected to a coil whose parameters are briefly described in the following. Equivalent circuit of the transponder Xpc Rpc Cp Uc Cchip Rchip Uc ... voltage at the connection pads fres ... resonant frequency of the transponder Xpc ... parallel reactance of the coil (f = 125 kHz) Rpc ... parallel resistance of the coil (f = 125 kHz) Cp ... parasitic capacitance of the package Cchip ... capacitance of the chip (Uc > 4 Vpp) Rchip ... resistance of the chip fresc ... self resonant frequency of the coil Lpc = Xpc/2 πf (f = 125 kHz) Lpc = 7.72 mH ± x % (C p = 0, x depends on the coil production process) Cchip = 210 pF ± 10 % Rpc > 45 k [ fresc > 750 kHz Note: The parasitic capacitance of the package (Cp) must be considered. () () f 1 2(C C ).L 125 kHz L = 1 2f C + C res chip p pc pc res chip p = + =⇒ π π 2 Typical values for Cp hot laminated cards: Cp = 1.5 pF moulded tags: Cp = 6.0 pF |
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