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ACT4070B Datasheet(PDF) 3 Page - Active-Semi, Inc

Part # ACT4070B
Description  Wide Input 3A Step Down Converter
PDF  9 Pages
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Manufacturer  ACTIVE-SEMI [Active-Semi, Inc]
Direct Link  http://www.active-semi.com
Logo ACTIVE-SEMI - Active-Semi, Inc

ACT4070B Datasheet(HTML) 3 Page - Active-Semi, Inc

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ACT4070B
Rev 0, 23-Apr-12
Innovative Power
TM
- 3 -
www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
VALUE
UNIT
IN to GND
-0.3 to + 34
V
EN to GND
-0.3 to VIN + 0.3
V
BS to SW
-0.3 to + 7
V
FB, COMP to GND
-0.3 to 6
V
Continuous SW Current
Internally limited
A
Junction to Ambient Thermal Resistance (θJA)
46
°C/W
Maximum Power Dissipation
1.8
W
Operating Junction Temperature
-40 to 150
°C
Storage Temperature
-55 to 150
°C
Lead Temperature (Soldering, 10 sec)
300
°C
SW to GND
-1 to VIN + 1
V
ELECTRICAL CHARACTERISTICS
(VIN = 12V, TA= 25°C, unless otherwise specified.)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX UNIT
Input Voltage
VIN
VOUT = 2.5V, ILOAD = 0A to 3A
6.5
30
V
Feedback Voltage
VFB
0.792 0.808 0.824
V
High-Side Switch On Resistance
RONH
130
mΩ
Low-Side Switch On Resistance
RONL
7.9
SW Leakage
VEN = 0, VIN = 12V, VSW = 0V
1
10
µA
High-Side Switch Peak Current
Limit
ILIM
Duty Cycle = 50%
3.7
A
COMP to Current Limit Transcon-
ductance
GCOMP
ΔILOAD/ΔICOMP
5.25
A/V
Error Amplifier Transconductance
GEA
ΔICOMP = ±10µA
650
µA/V
Error Amplifier DC Gain
AVEA
4000
V/V
Switching Frequency
fSW
250
300
330
kHz
Short Circuit Switching Frequency
VFB = 0V
44
kHz
Maximum Duty Cycle
DMAX
88
%
Minimum on Time
200
ns
Enable Threshold Voltage
Hysteresis = 0.1V
1.47
1.6
1.73
V
Enable Pull Up Current
Pin pulled up to VIN when left uncon-
nected
4
µA
Supply Current in Shutdown
VEN = 0
75
115
µA
IC Supply Current in Operation
VFB = 1.2V, not switching
0.675
1
mA
Thermal Shutdown Temperature
Hysteresis = 20°C
150
°C
VIN UVLO Turn-on Voltage
Input Voltage Rising
5.5
V
: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may
affect device reliability.



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