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ZIOL2201 Datasheet(PDF) 71 Page - List of Unclassifed Manufacturers |
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ZIOL2201 Datasheet(HTML) 71 Page - List of Unclassifed Manufacturers |
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71 / 91 page  ZIOL2xxx – IC Family IO-Link compliant HV Line Driver IC Family Data Sheet January 31, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 2.2.1 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is PRELIMINARY and subject to changes without notice. 71 of 90 Figure 6.1 Pin Diagram of the ZIOL2xxx 6.3. Optimal PCB Layout In order to obtain optimal heat distribution (minimized thermal resistance between package and board) certain PCB layout rules shall be applied. Those rules are described in the application note for the used QFN package (refer to chapter 8, [4]). Crucial for optimal heat distribution is the correct number, diameter and placement of via’s underneath the exposed die paddle as described in the above mentioned application note. |
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