HCPL0738 datasheet(2/8 Pages) HP

2 / 8 page

Package Outline Drawing

HCPL-0738 Outline Drawing (Small Outline SO-8 Package)

Ordering Information

Specify Part Number followed by

Option Number (if desired).

Example

HCPL-0738 -060 = VDE0884

Option

HCPL-0738 -500 = Tape and

Reel Packaging Option

No Option Code contains 100

units per tube. Option 500

contains 1500 units per reel.

Option data sheets available.

Contact Agilent Technologies

sales representative or authorized

distributor.

Selection Guide

Small Outline SO-8

HCPL-0738

Solder Reflow Temperature Profile

TIME (SECONDS)

200

100

150

100

200

250

300

SEC.

50 SEC.

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

XXX

YWW

ONE

7°

5.994 ± 0.203

(0.236 ± 0.008)

3.937 ± 0.127

(0.155 ± 0.005)

0.405 ± 0.076

(0.015 ± 0.003)

1.270

(0.050)

BSG

*5.080 ± 0.127

(0.205 ± 0.005)

3.175 ± 0.127

(0.125 ± 0.005)

1.524

(0.060)

45° x 0.432

(0.017)

0.228 ± 0.025

(0.009 ± 0.001)

0.202 ± 0.102

(0.008 ± 0.004)

TYPE NUMBER

(LAST 3 DIGITS)

DATE CODE

*TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

5.207 ± 0.254 (0.205 ± 0.010)

DIMENSIONS IN MILLIMETERS AND (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

0.305

(0.012)

MIN.

0 - 7°

HCPL0738 Datasheet(PDF) 2 Page - Agilent(Hewlett-Packard)

HCPL0738 Datasheet(HTML) 2 Page - Agilent(Hewlett-Packard)

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