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ADRF5515BCPZN-R7 Datasheet(PDF) 5 Page - Analog Devices

Part # ADRF5515BCPZN-R7
Description  Dual-Channel, 3.3 GHz to 4.0 GHz, 20 W Receiver Front End
PDF  15 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADRF5515BCPZN-R7 Datasheet(HTML) 5 Page - Analog Devices

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Data Sheet
ADRF5515
Rev. 0 | Page 5 of 15
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage (VDD)
VDD1-CHA, VDD1-CHB, VDD2-CHA,
and VDD2-CHB
7 V
SWVDD-CHAB
5.4 V
Digital Control Input Voltage
SWCTRL-CHAB
−0.3 V to VDD+ 0.3 V
BP-CHA, BP-CHB, and PD-CHAB
−0.3 V to VDD+ 0.3 V
Digital Control Input Current
BP-CHA, BP-CHB, PD-CHAB, and
SWCTRL-CHAB
20 mA
RF Input Power
Transmit Input Power (LTE Peak,
9 dB PAR)
53 dBm
Receive Input Power (LTE Peak,
9 dB PAR)
25 dBm
Temperature
Storage Range
−65°C to +150°C
Reflow
260°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the
operational section of this specification is not implied.
Operation beyond the maximum operating conditions for
extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operation environment. Careful attention to
PCB thermal design is required.
θJC is the junction to case bottom (channel to package bottom)
thermal resistance.
Table 3. Thermal Resistance
Package Type
θJC
Unit
CP-40-15
High Gain Mode
30
°C/W
Low Gain Mode
36
°C/W
Power-Down Mode
6
°C/W
ELECTROSTATIC DISCHARGE (ESD) RATINGS
The following ESD information is provided for handling of
ESD sensitive devices in an ESD protected area only.
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.
Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.
ESD Ratings for ADRF5515
Table 4. ADRF5515, 40-Lead LFCSP
ESD Model
Withstand Threshold
Class
HBM
1 kV
1C
CDM
750 V
ESD CAUTION



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