ADGS1612BCPZ datasheet(13/29 Pages) AD

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Data Sheet

ADGS1612

Rev. 0 | Page 13 of 29

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 8.

Parameter

Rating

VDD to VSS

18 V

VDD to GND

−0.3 V to +18 V

VSS to GND

+0.3 V to −18 V

RESET/VL to GND

VDD ≤ 5.5 V

−0.3V to VDD + 0.3 V

VDD > 5.5 V

−0.3 V to +6 V

Analog Inputs1

VSS − 0.3 V to VDD + 0.3 V or

30 mA, whichever occurs first

Digital Inputs1

−0.3 V to +6 V

Peak Current, Sx or Dx Pins2

546 mA (pulsed at 1 ms, 10%

duty cycle maximum)

Continuous Current, Sx or Dx2, 3

Data + 15%

Temperature Ranges

Operating

−40°C to +125°C

Storage

−65°C to +150°C

Junction Temperature

150°C

Reflow Soldering Peak

Temperature, Pb-Free

260°C

1 Overvoltages at the digital, Sx, and Dx pins are clamped by internal diodes.

Limit current to the maximum ratings given.

2 Sx refers to the S1 to S4 pins, and Dx refers to the D1 to D4 pins.

3 See Table 5 and Table 6.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Only one absolute maximum rating can be applied at any one time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 9. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-24-171

°C/W

1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board. See JEDEC JESD51.

ESD CAUTION

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