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24CSM01 Datasheet(PDF) 49 Page - Microchip Technology |
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24CSM01 Datasheet(HTML) 49 Page - Microchip Technology |
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49 / 63 page  2023 Microchip Technology Inc. and its subsidiaries Preliminary DS20006781B -page 49 24CSM01 RECOMMENDED LAND PATTERN Dimension Limits Units Contact Pitch MILLIMETERS 1.27 BSC MIN E MAX Contact Pad Length (X8) Contact Pad Width (X8) Y X 1.70 0.65 NOM Z Overall Width 9.00 Contact Pad to Contact Pad (X6) G2 0.62 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 8-Lead Plastic Small Outline (SM) - Medium, 5.28 mm (.208 Inch) Body [SOIJ] Contact Pad to Contact Pad (X4) G1 5.60 Microchip Technology Drawing C04-2056 Rev E C Contact Pad Spacing 7.30 E X Y G2 C Z SILK SCREEN G1 |
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