AD7376ARUZ10-R7 datasheet(7/20 Pages) AD

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AD7376

Rev. D | Page 7 of 20

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 5.

Parameter

Rating

VDD to GND

−0.3 V to +35 V

VSS to GND

+0.3 V to −16.5 V

VDD to VSS

−0.3 V to +35 V

VA, VB, VW to GND

VSS to VDD

Maximum Current

IWB, IWA Pulsed

±20 mA

IWB Continuous (RWB ≤ 6 kΩ, A open,

VDD/VSS = 30 V/0 V)1

±5 mA

IWA Continuous (RWA ≤ 6 kΩ, B open,

VDD/VSS = 30 V/0 V)1

±5 mA

Digital Input and Output Voltages to GND

0 V to VDD + 0.3 V

Operating Temperature Range

−40°C to +85°C

Maximum Junction Temperature (TJMAX)2

150°C

Storage Temperature Range

−65°C to +150°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

20 sec to 40 sec

Package Power Dissipation

(TJMAX − TA)/θJA

Thermal Resistance θJA

16-Lead SOIC_W

120°C/W

14-Lead TSSOP

240°C/W

Maximum terminal current is bound by the maximum current handling of

the switches, maximum power dissipation of the package, and maximum

applied voltage across any two of the A, B, and W terminals at a given

resistance.

Package power dissipation = (TJMAX – TA)/θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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