AX2000 datasheet(9/262 Pages) MICROSEMI

9 / 262 page

Axcelerator Family FPGAs

Re vi s i on 18

1-3

Two C-cells, a single R-cell, two Transmit (TX), and two Receive (RX) routing buffers form a Cluster,

while two Clusters comprise a SuperCluster (Figure 1-4). Each SuperCluster also contains an

independent Buffer (B) module, which supports buffer insertion on high-fanout nets by the place-and-

route tool, minimizing system delays while improving logic utilization.

The logic modules within the SuperCluster are arranged so that two combinatorial modules are side-by-

side, giving a C–C–R – C–C–R pattern to the SuperCluster. This C–C–R pattern enables efficient

implementation (minimum delay) of two-bit carry logic for improved arithmetic performance (Figure 1-5

on page 1-3).

The AX architecture is fully fracturable, meaning that if one or more of the logic modules in a

SuperCluster are used by a particular signal path, the other logic modules are still available for use by

other paths.

At the chip level, SuperClusters are organized into core tiles, which are arrayed to build up the full chip.

For example, the AX1000 is composed of a 3x3 array of nine core tiles. Surrounding the array of core

tiles are blocks of I/O Clusters and the I/O bank ring (Table 1-1). Each core tile consists of an array of 336

SuperClusters and four SRAM blocks (176 SuperClusters and three SRAM blocks for the AX250).

Figure 1-4 •

AX SuperCluster

Figure 1-5 •

AX 2-Bit Carry Logic

Table 1-1 • Number of Core Tiles per Device

Device

Number of Core Tiles

AX125

1 regular tile

AX250

4 smaller tiles

AX500

4 regular tiles

AX1000

9 regular tiles

AX2000

16 regular tiles

DCOUT

C-Cell

Carry Logic

FCI

FCO

AX2000 Datasheet(PDF) 9 Page - Microsemi Corporation