SP3T PIN Diode Switch

Rev. V1

MSW310x-310

14

14

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DS-xxxxxxx

14

COMPANY LOGO

DATE CODE

PART NUMBER

6. Hatched metal area on circuit side of device is RF, DC and thermal grounded.

7. Vias should be solid copper fill and gold plated for optimum heat transfer from backside of switch module through Circuit Vias to metal

thermal ground.

RF Circuit Solder footprint