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MB39C011A Datasheet(PDF) 50 Page - Cypress Semiconductor |
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MB39C011A Datasheet(HTML) 50 Page - Cypress Semiconductor |
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50 / 53 page ![]() Document Number: 002-08369 Rev. *B Page 50 of 53 MB39C011A 28.2 Parameters for Each Mounting Method 28.2.1 IR (infrared reflow) 28.2.2 Manual soldering (partial heating method) Conditions : Temperature 400˚C Max Times : 5 s max/pin 260 °C (e) (d') (d) 255 °C 170 °C 190 °C RT (b) (a) (c) to Note : Temperature : the top of the package body (a) Temperature Increase gradient : Average 1˚C/s to 4˚C/s (b) Preliminary heating : Temperature 170˚C to 190˚C, 60s to 180s (c) Temperature Increase gradient : Average 1˚C/s to 4˚C/s (d) Actual heating : Temperature 260˚C Max; 255˚C or more, 10s or less (d’) : Temperature 230˚C or more, 40s or less or Temperature 225˚C or more, 60s or less or Temperature 220˚C or more, 80s or less (e) Cooling : Natural cooling or forced cooling H rank : 260˚C Max |
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