CXP87452 datasheet(32/32 Pages) SONY

Part #	CXP87452

Description	CMOS 8-bit Single Chip Microcomputer

PDF	32 Pages

Scroll/Zoom	100%

Manufacturer	SONY [Sony Corporation]

Direct Link	http://www.sony.co.jp

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32 / 32 page

– 32 –

CXP87452/87460

Package Outline

Unit: mm

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY RESIN

SOLDER PLATING

COPPER / 42 ALLOY

PACKAGE STRUCTURE

23.9 ± 0.4

QFP-100P-L01

DETAIL A

100PIN QFP (PLASTIC)

20.0 – 0.1

+ 0.4

0° to 15°

0.15 – 0.05

+ 0.1

2.75 – 0.15

+ 0.35

0.65

±0.12

0.15

∗QFP100-P-1420-A

1.4g

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY/PHENOL RESIN

SOLDER PLATING

42 ALLOY

PACKAGE STRUCTURE

DETAIL A

LQFP-100P-L01

∗QFP100-P-1414-A

100PIN LQFP (PLASTIC)

16.0 ± 0.2

∗

14.0 ± 0.1

0.5 ± 0.08

0.18 – 0.03

+ 0.08

(0.22)

1.5 – 0.1

+ 0.2

0.127 – 0.02

+ 0.05

0° to 10°

0.1 ± 0.1

100

0.1

NOTE: Dimension “

∗” does not include mold protrusion.

CXP87452 Datasheet(PDF) 32 Page - Sony Corporation

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