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L99VR01STR Datasheet(PDF) 32 Page - STMicroelectronics |
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L99VR01STR Datasheet(HTML) 32 Page - STMicroelectronics |
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32 / 47 page ![]() 6.2 SO-8 thermal data Figure 48. SO-8 PC board Note: Layout condition of Rth and Zth measurements (PCB: double layer and four layers; FR4 area = 77 mm x 86 mm; PCB thickness = 1.6 mm; Cu thickness = 0.070 mm (front and back side), Cu thickness 0.035mm (inner layers); Thermal vias separation 1.2 mm, Thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias of 0.025 mm, Footprint dimension 2.2 mm x 2.9 mm. L99VR01 SO-8 thermal data DS13649 - Rev 3 page 32/47 |
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